Next-Generation Temporary Adhesives for Precision Microfabrication
Hot-Melt Temporary Adhesives
In precision processing of semiconductor wafers and magnetic materials, stable fixation of the workpiece is critical for both quality and process efficiency.
DNP Fine Chemicals’ hot-melt temporary adhesives are used in manufacturing processes such as polishing and cutting, contributing to improved surface precision through flatter polishing and enabling miniaturization through high-precision cutting. Depending on the application, we offer both liquid and solid types, providing optimal performance tailored to each process.
What is a Temporary Adhesive?
A temporary adhesive is a specialized adhesive used to temporarily fix electronic components, such as semiconductor wafers and magnetic materials, during manufacturing processes like polishing and cutting.
Since the adhesive must be easily removable after processing, it is important to achieve an optimal balance of adhesion strength and peelability, tailored to the material of the workpiece and the process conditions.
Main Applications of Temporary Adhesives
Adhesives for Wafer Polishing, Including Silicon
These temporary adhesives are used to securely fix wafers, such as silicon and sapphire, during surface polishing processes. They offer uniform coatability, appropriate adhesion strength, easy peelability, and high cleanability, allowing for simple residue removal after processing.
DNP Fine Chemicals also provides grades with minimized metallic impurities to meet the high-purity requirements of semiconductor manufacturing processes.
Adhesives for Cutting Magnetic Materials
These are solid-type temporary adhesives used for cutting hard and brittle materials, such as magnetic materials and glass. They provide excellent workpiece retention during cutting, suppressing vibrations and misalignment, thereby contributing to improved processing accuracy. We offer a lineup that allows selection of workability and peel methods according to the application.
DNP Fine Chemicals’ Temporary Adhesives
DNP Fine Chemicals develops, manufactures, and sells high-precision hot-melt temporary adhesives to meet the stringent requirements of semiconductor manufacturing and magnetic material processing. A key feature is the ability to flexibly customize the composition—including viscosity, adhesion strength, and peelability—according to the customer’s production line and processing conditions.
This contributes to improved workpiece fixation stability, easier post-process removal, higher yield, increased process efficiency, and overall cost reduction. Additionally, we provide comprehensive technical support from proposing optimal specifications to evaluation assistance, ensuring smooth implementation from prototyping to mass production.
Features of DNP Fine Chemicals’ Temporary Adhesives
･Liquid adhesives used in polishing processes for semiconductor wafers do not contain toluene, a solvent of concern for human health.
･Grades for semiconductor applications suppress metallic impurities to extremely low levels, meeting stringent process requirements.
･Solid adhesives used in cutting processes for magnetic materials are available in four types—sheet, rod, powder, and tablet—offering a wide range of adhesion strengths and softening points.
･Both liquid and solid adhesives can be easily cleaned with alkaline cleaning solutions.
Note: Alkaline cleaning solutions are also provided as part of the offering.
Core Technologies for Temporary Adhesive Development and Manufacturing
Resin Synthesis Technology
The performance of temporary bonding adhesives is largely determined by resin design. Sophisticated material design is therefore essential to achieve an optimal balance among holding strength, debonding performance, and cleanability.
We design and synthesize resins in-house to suit specific applications and manufacturing processes. By rapidly advancing development from evaluation through mass production, we provide flexible solutions tailored to customer requirements, accelerate production ramp-up, and support the early resolution of manufacturing challenges.
Evaluation and Analysis Technology
We possess proprietary evaluation and analytical technologies that accurately simulate our customers’ manufacturing processes and assess the various properties required of temporary bonding adhesives, including adhesion strength, peel strength, coating uniformity, and cleanability.
These capabilities enable performance verification under conditions closely resembling actual manufacturing processes, contributing to product optimization and improved production yields.
Frequently Asked Questions About Temporary Adhesive Development and Manufacturing
Q. How Should Liquid and Solid Types of Temporary Adhesives Be Used?
A. Liquid-type adhesives are suitable for polishing processes that require surface flattening and high-precision fixation, as they can conform to fine surface irregularities.
Solid-type adhesives are ideal for cutting processes, providing strong and stable workpiece fixation, and are available in various forms, such as sheets and rods.
Since the required physical properties differ significantly between the two types, it is important to select liquid or solid adhesives appropriately according to the process and application.
Q. What Types of Materials Can Be Used with Temporary Adhesives?
A. They can be used with a wide range of electronic component materials that require temporary fixation during polishing or cutting processes, including semiconductor wafers, magnetic materials, and ceramics.
Q. Are Environmental and Safety Considerations Adequately Addressed?
A. Our temporary adhesives include solvent-based types that do not use toluene, as well as solid types with no flash point that are environmentally friendly. They are designed with consideration for both human health and the environment.
Q. Is It Possible to Develop Custom-Specification Temporary Adhesives?
A. Yes. We can develop and manufacture custom adhesives tailored to specific processing conditions and materials. Please feel free to contact us for consultation.
Q. Are Prototypes or Small-Lot Testing Available?
A. Depending on your consultation, we can also provide samples for prototyping and small-lot evaluation.
Q. Is It Possible to Request Performance Testing for Adhesives?
A. Using our evaluation and analysis technologies, we can conduct tests such as adhesion strength, cleanability, and coating uniformity, enabling us to provide optimal proposals tailored to customer needs.
Leave Temporary Adhesive Development and Manufacturing to DNP Fine Chemicals
DNP Fine Chemicals’ temporary adhesives leverage technology and reliability cultivated in precision processing, achieving both operational efficiency and product quality. We invite you to consider our products, which can provide new value to your manufacturing processes.
Please note that inquiries from individual customers cannot be accepted. Thank you for your understanding.
