SEMICON Japan 2024
- Event Date(s)
December 11-13, 2024
10:00 am - 5:00 pm JST
- Venue
Tokyo Big Sight, Tokyo, Japan
（申込締切日や外部サイトに飛ぶなど注意事項を記載）
Registration has closed.
SEMICON Japan 2024
SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends, and innovations as the industry powers digital transformation. SEMICON Japan 2024 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT).
Exhibited products
DNP is currently focusing on solving social issues and creating new values that meet people's expectations by synergizing our unique strengths P&I (printing and information) and extending collaboration with external partners.
Our products will be showcased at this exhibition: Extreme Ultra-Violet (EUV) lithography photomask, Nanoimprint Lithography (NIL) template, Co-packaged optics substrate, and other highly functional industrial materials.
Photomask for EUV lithography
A photomask with pellicle for EUV lithography, the most advanced semiconductor process.
NIL template
A template for nanoimprint lithography. There are high expectations for this template as a new technology capable of supporting both shrinking chip structure and power consumption reduction in the semiconductor manufacturing process.
Co-packaged optics substrate
DNP will exhibit our glass wiring substrate with polymer optical waveguide, which is required in next-generation data centers where both power saving and high performance are needed.
Ultra Clean Peelable Film（UCPF）
This clean packaging material is specifically designed for products such as semiconductors, electronic components, and precision parts, which require stringent particle and contamination control.