DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
Participates in JOINT2, consortium targeting mass-production in 2024
2021年12月7日
Dai Nippon Printing Co., Ltd. (DNP) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging. DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).
[Background]
The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It has been pointed out, however, that further miniaturization is rapidly approaching its natural limit, due to the complexity of the process and high costs.
In an attempt to overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.
Interposer Features
The interposer developed by DNP overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging. DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by taking advantage of microfabrication technology based on printing processes. We also broadly expand businesses through micro-electro mechanical systems (MEMS) foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.
Interposer produced on a glass substrate (40x40mm)
Going Forward
Through development at JOINT2 and collaboration with participating companies, DNP will accelerate efforts to develop interposer functions and mass-produce them, and promote the development of next-generation semiconductor packaging technology. In addition, by leveraging its unique strengths in P&I (Printing and Information), DNP will provide solutions that support a comfortable information society, such as providing a platform that enhances information security for electronic components for next-generation communications and IoT (Internet of Things).
- 1 JOINT2 (Jisso Open Innovation Network of Tops 2): A consortium of 12 companies involved in the development of semiconductor packaging materials and equipment, with the aim of establishing packaging and evaluation technologies for next-generation semiconductors. Showa Denko Materials Co., Ltd. (Director CEO: Maruyama Hisashi) is the managing company, and the consortium was selected for the New Energy and Industrial Technology Development Organization (NEDO)'s publicly solicited project, "Research and Development Project to Strengthen the Infrastructure of Post-5G Information and Communications Systems/Development of Advanced Semiconductor Manufacturing Technology."
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