DNP to Exhibit at ECTC 2026
Showcase of TGV glass-core substrates, co-packaged optics for next-generation semiconductor packaging
ECTC is an internationally recognized conference and exhibition for semiconductor packaging. At ECTC 2026, DNP will introduce semiconductor-related products and technologies developed by applying proprietary processing technologies cultivated through printing processes, including metal and glass etching technologies and plating technologies that provide functionality by coating thin metal films onto material surfaces.
DNP will present solutions that address global technology trends and social issues, including the growing power consumption associated with the spread of AI, as well as demand for higher-efficiency and larger-area packaging. Exhibits will include Through Glass Via (TGV) glass-core substrates for next-generation semiconductor packaging, thin metal vapor chamber heat-dissipating components, and co-packaged optics technologies.
ECTC 2026 Summary
- Conference dates: May 26 – 29, 2026
- Exhibition dates: May 27 – 28, 2026
- Venue: JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida
- DNP booth number: 1104
- Official website: https://ectc.net
DNP Presentations
DNP will also deliver the following technical presentations at ECTC 2026. All times are local time.
- Session 15: Optical Interconnects, Oral Session, May 28, 2026, 11:35 – 11:55 a.m.
“High-Density Polymer Waveguide Integration on Glass Substrate for CPO”
-Session 19: Substrate Core Innovations: Glass, Ceramic, and Silicon, Oral Session, May 28, 2026, 4:05–4:25 p.m.
“Development of Long-Term Reliability for Glass Core Substrates with Build-Up Layers”
DNP Exhibits
TGV Glass-Core Substrates for Next-Generation Semiconductor Packages
DNP will exhibit TGV glass-core substrates designed to replace conventional resin substrates and support higher efficiency and larger-area semiconductor packages. High-density Through Glass Via technology enables the development of higher-performance semiconductor packages for next-generation applications.
https://www.global.dnp/en/news/detail/2023/03/0320_20169052/
Vapor Chamber, Heat-Dissipating Components
DNP will exhibit thin metal vapor chambers, a type of heat-dissipating component that rapidly spreads and dissipates heat through the evaporation and condensation of water. DNP has developed a vapor chamber that combines high thermal conductivity, a thin profile and flexibility.
https://www.global.dnp/en/news/detail/2020/01/0123_20167124/
*Company and product names mentioned in this release are the trademarks or registered trademarks of their respective owners.
*The content of this release is current as of the date of announcement. It may be changed without notice.
May20,2026
ECTC is an internationally recognized conference and exhibition for semiconductor packaging. At ECTC 2026, DNP will introduce semiconductor-related products and technologies developed by applying proprietary processing technologies cultivated through printing processes, including metal and glass etching technologies and plating technologies that provide functionality by coating thin metal films onto material surfaces.
DNP will present solutions that address global technology trends and social issues, including the growing power consumption associated with the spread of AI, as well as demand for higher-efficiency and larger-area packaging. Exhibits will include Through Glass Via (TGV) glass-core substrates for next-generation semiconductor packaging, thin metal vapor chamber heat-dissipating components, and co-packaged optics technologies.
ECTC 2026 Summary
- Conference dates: May 26 – 29, 2026
- Exhibition dates: May 27 – 28, 2026
- Venue: JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida
- DNP booth number: 1104
- Official website: https://ectc.net
DNP Presentations
DNP will also deliver the following technical presentations at ECTC 2026. All times are local time.
- Session 15: Optical Interconnects, Oral Session, May 28, 2026, 11:35 – 11:55 a.m.
“High-Density Polymer Waveguide Integration on Glass Substrate for CPO”
-Session 19: Substrate Core Innovations: Glass, Ceramic, and Silicon, Oral Session, May 28, 2026, 4:05–4:25 p.m.
“Development of Long-Term Reliability for Glass Core Substrates with Build-Up Layers”
DNP Exhibits
TGV Glass-Core Substrates for Next-Generation Semiconductor Packages
DNP will exhibit TGV glass-core substrates designed to replace conventional resin substrates and support higher efficiency and larger-area semiconductor packages. High-density Through Glass Via technology enables the development of higher-performance semiconductor packages for next-generation applications.
https://www.global.dnp/en/news/detail/2023/03/0320_20169052/
Vapor Chamber, Heat-Dissipating Components
DNP will exhibit thin metal vapor chambers, a type of heat-dissipating component that rapidly spreads and dissipates heat through the evaporation and condensation of water. DNP has developed a vapor chamber that combines high thermal conductivity, a thin profile and flexibility.
https://www.global.dnp/en/news/detail/2020/01/0123_20167124/
- Company and product names mentioned in this release are the trademarks or registered trademarks of their respective owners.
- The content of this release is current as of the date of announcement. It may be changed without notice.