DNP to Exhibit at ECTC 2026
Showcase of TGV glass-core substrates, co-packaged optics for next-generation semiconductor packaging
May 20, 2026
ECTC is an internationally recognized conference and exhibition for semiconductor packaging. At ECTC 2026, DNP will introduce semiconductor-related products and technologies developed by applying proprietary processing technologies cultivated through printing processes, including metal and glass etching technologies and plating technologies that provide functionality by coating thin metal films onto material surfaces.
DNP will present solutions that address global technology trends and social issues, including the growing power consumption associated with the spread of AI, as well as demand for higher-efficiency and larger-area packaging. Exhibits will include Through Glass Via (TGV) glass-core substrates for next-generation semiconductor packaging, thin metal vapor chamber heat-dissipating components, and co-packaged optics technologies.
ECTC 2026 Summary
- Conference dates: May 26 – 29, 2026
- Exhibition dates: May 27 – 28, 2026
- Venue: JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida
- DNP booth number: 1104
- Official website: https://ectc.net
DNP Presentations
DNP will also deliver the following technical presentations at ECTC 2026. All times are local time.
- Session 15: Optical Interconnects, Oral Session, May 28, 2026, 11:35 – 11:55 a.m.
“High-Density Polymer Waveguide Integration on Glass Substrate for CPO”
-Session 19: Substrate Core Innovations: Glass, Ceramic, and Silicon, Oral Session, May 28, 2026, 4:05–4:25 p.m.
“Development of Long-Term Reliability for Glass Core Substrates with Build-Up Layers”
DNP Exhibits
TGV Glass-Core Substrates for Next-Generation Semiconductor Packages
DNP will exhibit TGV glass-core substrates designed to replace conventional resin substrates and support higher efficiency and larger-area semiconductor packages. High-density Through Glass Via technology enables the development of higher-performance semiconductor packages for next-generation applications.
https://www.global.dnp/en/news/detail/2023/03/0320_20169052/
Vapor Chamber, Heat-Dissipating Components
DNP will exhibit thin metal vapor chambers, a type of heat-dissipating component that rapidly spreads and dissipates heat through the evaporation and condensation of water. DNP has developed a vapor chamber that combines high thermal conductivity, a thin profile and flexibility.
https://www.global.dnp/en/news/detail/2020/01/0123_20167124/
*Company and product names mentioned in this release are the trademarks or registered trademarks of their respective owners.
*The content of this release is current as of the date of announcement. It may be changed without notice.
Dai Nippon Printing Co., Ltd. (DNP) will be exhibiting at "ECTC 2026," an international conference and exhibition in the semiconductor packaging field, to be held in Florida, USA from May 26 (Tue) to May 29 (Fri), 2026.
DNP positions Semiconductors businesses as one of its focus businesses, expanding existing businesses and developing new ones. At this conference and exhibition, we will introduce semiconductor-related products developed using processing technologies cultivated based on printing technologies, such as etching technology for metals and glass, and plating technology that coats thin metal films on the surface of metals and other materials to impart Semiconductors. Specifically, we will announce and exhibit solutions that address global social challenges and trends such as the increase in power consumption accompanying the spread of AI and the need for higher efficiency and larger area packaging substrates, including "glass core substrates" for next-generation packages, thin metal heat dissipation components "vapor chamber," and optoelectronic integration technology.
Overview of ECTC 2026 and Exhibits/Presentations
■ECTC 2026 Event Overview
Event Period: May 26th (Tue) - 29th (Fri), 2026
*The conference will be held from May 26th (Tue) to 29th (Fri), and the exhibition will be held on May 27th (Wed) and 28th (Thu) for two days.
Venue: JW Marriott & The Ritz-Carlton Grande Lakes Resort
DNP Booth Number: 1104
〇公式サイト → https://ectc.net
■DNP's Main Announcements and Exhibits
○ Presentation of academic papers (local time):
- Thursday, May 28th 11:35~11:55 Session 15 Optical Interconnects, Oral Session “High-Density Polymer Waveguide Integration on Glass Substrate for CPO”
- Thursday, May 28th 16:05~16:25 Session 19 Substrate Core Innovations: Glass, Ceramic, and Silicon, Oral Session “Development of Long-Term Reliability for Glass Core Substrates with Build-Up Layers”
○Examples of products exhibited at trade shows
TGV (Through Glass Via) glass core substrates for next-generation semiconductor packaging.
従来の樹脂基板からガラス基板に置き換えることで、高効率・大面積化に対応する「TGVガラスコア基板」を展示します。高密度なTGVによって、従来以上に高性能な半導体パッケージの提供が可能になります。（https://www.dnp.co.jp/news/detail/20169059_1587.html）
Thin metal heat dissipation component "vapor chamber"
ベイパーチャンバーは、水の気化と凝縮によって、瞬時に熱を拡散させて放熱できる「金属製放熱部材」の一種です。DNPでは、高い熱伝導率と薄型化に加え、フレキシブルに曲げられる機能を兼ね備えたベイパーチャンバーを開発しました。（https://www.dnp.co.jp/biz/products/detail/20172750_4986.html）
- Company and product names mentioned in this release are the trademarks or registered trademarks of their respective owners.
- Information contained in this release is current as of the date of announcement. It may be changed without notice.