Your everyday smartphones are powered by many of DNP's cutting-edge components

DNP's technological prowess enables us to continuously develop indispensable smartphone components. These include miniaturized sensors, efficient heat dissipation, easily viewable displays, core elements in semiconductor manufacturing processes, and lightweight, secure packages for lithium-ion batteries.

• Display components
• Compactness and high performance
• Microchip manufacturing

Display components

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  Flexible hard coat film

  Essential components for foldable displays

  A Flexible hard coat film that is both rigid and flexible. This film not only enhances the visibility and vividness of displays on foldable smartphones but also improves the visual experience on tablets, PCs, and various other devices.

  By employing clean converting technology that processes materials in a manufacturing environment with excellent dust resistance, it becomes feasible to incorporate various functions. These functions may include scratch resistance akin to glass, along with antistatic and antifouling properties, depending on the device in use.

  

  Further product and service information

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  Film with ultrafine wiring

  Adding transparency to antennas for universal installation in any location

  This is a conductive antenna film featuring invisible fine wiring on a transparent film substrate. It can be applied to the displays of mobile devices to introduce an antenna function. Its transparency enables the addition of antenna functions to diverse 5G-compatible products like information terminals, IoT devices, and base stations, without compromising the design.

  Through the application of DNP's microfabrication technology, metal components, such as a 1-micron (1/1,000 mm) line width, are intricately wired into an ultra-fine mesh.

  

  the details

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  Optical films for displays

  Enhancing display visibility

  This optical film manages the reflection of light on the display. A diverse range of films is available for various applications, including AR (Anti-Reflection) film that minimizes reflected light and AG (Anti-Glare) film that diminishes the impact of outside light reflections. For the increasingly popular OLED displays, we also design and provide retardation films that prevent contrast loss and correct color tones.

  Our distinctive optical design technology has empowered us to realize a variety of functions crucial for optical films. DNP's exclusive coating technology, allowing the installation of multiple coating systems on a single production line, is another strength. DNP excels in mass-producing optical films with multiple functions and holds the leading share in the global market.

  

  

  AR film product details

  AG film product details

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Compactness and high performance

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  DOE (Diffractive Optical Elements）

  Miniaturizing sensors and camera lenses

  DNP has innovated a compact element capable of forming patterns and illuminating through the diffraction phenomenon of light (the property of light to act as a wave and create strength and weakness through interference). The device is applicable to ultraviolet to near-infrared light, encompassing a broader wavelength range than visible light. This innovation will contribute to the miniaturization of information equipment by enabling the capture of more light with smaller components for sensors and cameras.

  The application of optical design and microfabrication technology (nanoimprint lithography), honed over many years in holograms and photomasks for semiconductors, enhances the functionality of this device.

  

  the details

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  Vapor chamber

  Heat-dissipating materials that can be bent into the required shape

  Vapor chamber is a form of metal heat dissipation material characterized by high thermal conductivity. This material is suitable for use in slim electronic devices. Due to its flexible bendability into the required shape, it finds application in wearable devices with extremely narrow and non-linear designs.

  It leverages DNP's etching technology, employing chemicals to corrode metals and process their surfaces. Through this precise etching technique, the company has achieved a thickness approximately half that of conventional products (0.20 mm thickness). This not only ensures efficient heat dissipation but also enhances the freedom in designing devices.

  

  

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Microchip manufacturing

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  Photomask and nano imprint lithography template for semiconductor production

  Responding to the need for ever finer circuit line widths in line with the shift to high-performance

  Photomasks are used in photolithography for the production of integrated circuits to produce a pattern on a wafer. DNP can also provide photomasks for EUV (Extreme Ultra-Violet) lithography for high-edge semiconductor manufacturing.
  Furthermore, we have developed the template for nano imprinting lithography, to facilitate the realization of new semiconductor manufacturing processes with low power consumption.

  DNP's nano processing technology, cultivated over 60 years as a photomask supplier, is harnessed to resolute intricate circuit patterns ranging from micrometers to nanometers patterning. In photomasks for advanced semiconductors, we maintain critical dimensional accuracy of less than 1 nm.

  

  

  Related news release about photomasks for EUV lithography

  Related article about nanoimprint lithography

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  Lead frame

  Enhancing the reliability of semiconductor packages

  DNP is actively advancing the development of lead frames designed to secure IC chips and establish connections to the external environment, aiming to achieve "smaller and higher pin counts." This approach effectively enhances the performance of IC chips. Moreover, automotive packages demand heightened reliability to thwart moisture ingress. By employing copper "roughening technology," DNP has bolstered the seal between the resin encapsulating the IC chip and the lead frame.

  We have implemented and refined our exclusive microfabrication technology to achieve precise silver plating area formation, supporting the goals of "miniaturization and high pin counts."

  

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